Senior Package Engineer
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Job Description
Sr. Package Engineer developing bumping, flip-chip, and WLCSP processes for SiTime’s MEMS semiconductor timing products. Improving yield, quality, and manufacturing efficiency.
Responsibilities:
- Develop, optimize, and characterize packaging processes for WLCSP technologies, including bumping, RDL formation, underfill, and dicing
- Perform root cause analysis and implement corrective and preventive actions using 8D methodology
- Collaborate with R&D, design, equipment, and manufacturing teams to transfer processes from development to high-volume manufacturing
- Lead or participate in cross-functional new product introduction (NPI) and process improvement projects
- Evaluate and qualify new materials, equipment, and processes for technology roadmaps and production requirements
- Stay current with packaging technology trends and advancements
- Conduct process capability analysis using Cp/Cpk
- Implement SPC and continuous improvement initiatives to improve yield, quality, and cost-efficiency
- Define and maintain process specifications, control plans, and SOPs
- Provide technical support and training to manufacturing operators and technicians
Requirements:
- Experience or expertise in Bumping, Flip-chip, and Wafer-Level Chip Scale Packaging (WLCSP) technologies
- Ability to develop, optimize, characterize, and sustain advanced packaging processes
- Knowledge of bumping, re-distribution layer (RDL) formation, underfill, and dicing
- Experience performing root cause analysis and implementing corrective and preventive actions using 8D methodology
- Ability to conduct process capability analysis (Cp/Cpk)
- Knowledge of statistical process control (SPC)
- Ability to define and maintain process specifications, control plans, and standard operating procedures (SOPs)
- Knowledge of materials and packaging/manufacturing equipment
- Knowledge of safety and quality standards, including Good Manufacturing Practices (GMP)
- Ability to provide technical support and training to manufacturing operators and technicians
- Ability to collaborate with R&D, design, equipment, and manufacturing teams
- Strong problem-solving, attention to detail, and technical communication skills
Benefits:
- Quarterly bonus tied to the achievement of innovation goals
- Equity grants
- Comprehensive and highly competitive compensation package
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