Senior Module Design Engineer
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Job Description
Senior engineer leading Molex AEC and ACC module design for AI, hyperscale data centers, storage, and telecom. Taking high-speed interconnect products from concept through production launch.
Responsibilities:
- Lead the electrical and module design of AEC and ACC products from concept and architecture through engineering validation, design validation, qualification, and production launch
- Develop micro engineering schedules, identify technical risks, coordinate dependencies, and drive design activities to completion with minimal direction
- Partner with signal integrity, hardware, firmware, mechanical, thermal, manufacturing-integration, quality, program-management, sales, and laboratory teams
- Translate customer, marketing, application engineering, and external partner inputs into product concepts and detailed design requirements
- Develop cost-competitive, manufacturable designs meeting electrical, signal-integrity, power, thermal, electromagnetic-interference, reliability, and performance requirements
- Resolve design-for-manufacturability issues with process engineering, production engineering, suppliers, and manufacturing sites
- Engage ASIC vendors and component suppliers to evaluate technologies, interfaces, constraints, and product roadmaps
- Provide hands-on technical support during prototype builds, laboratory characterization, qualification, and product launch
- Mentor less-experienced engineers and provide technical guidance across multiple new-product-development projects
- Travel as needed to collaborate with global teams, suppliers, customers, laboratories, and manufacturing sites
Requirements:
- Bachelor's degree in Electrical Engineering or a closely related field
- At least 7 years of experience in electrical or optical module design and development, including demonstrated technical leadership
- Strong analog circuit-design skills
- Understanding of circuit theory, linear systems, feedback, integrated circuits, and high-speed signaling fundamentals
- Ability to develop engineering solutions involving signal integrity, power integrity, noise, thermal performance, and electromagnetic interference
- In-depth knowledge of printed circuit board materials, fabrication processes, assembly processes, and board-level design cycles
- Strong laboratory measurement, troubleshooting, and root-cause-analysis skills
- Experience developing electronic products in a cross-functional environment
- Ability to plan complex assignments, manage technical risk, solve problems systematically, and communicate clearly with global stakeholders
- Travel as needed to collaborate with global teams, suppliers, customers, laboratories, and manufacturing sites
- Successful completion of a drug test may be required where permitted by state law
- Employment verification through E-Verify
Benefits:
- Variable pay, issued as a monetary bonus or in another form
- Medical, dental, and vision coverage
- Flexible spending and health savings accounts
- Life insurance
- AD&D
- Disability coverage
- Retirement plan
- Paid vacation/time off
- Educational assistance
- May include infertility assistance
- May include paid parental leave
- May include adoption assistance
- Flexible work environment
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