Lead Photonics Systems Process Engineer
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Job Description
Lead Process Engineer at Jabil enabling design and manufacturing for co-packaged optics systems. Focused on high yield manufacturing and process development for complex photonic systems.
Responsibilities:
- Design and execute process development studies/experiments for establishing best – practice manufacturing environments and process flows for CPO systems.
- Devise product-specific manufacturing processes and define interim-step manufacturing specs/control gates based on a deep understanding of end-to-end manufacturing flow and packaging/assembly requirements.
- Support CPO systems manufacturing lines bring up and NPI phase at Jabil’s factories, as well as train local factory engineering staff to sustain and further develop manufacturing operations afterwards
- Maintain an ongoing engagement with the factory operations and engineering teams to provide engineering guidance / support as needed to established lines.
- Participate in client early engagement to funnel requirements and specs required for their product’s manufacturing process flow
- Establish and provide DFM and FMEA guidance for CPO systems
- Generate clear documentation of process steps, requirements, specs. Assist factory in translating these into work instructions and visual aids and verify these reflect correctly the requirements.
- Keep abreast of new technologies pertaining to the manufacturing of co-packaged-optics systems with a focus on photonics packaging, fiber-optic connectivity, and cutting edge SMT tooling and processes.
Requirements:
- Relevant Bachelor’s 4 – year degree in engineering, physics, chemistry, material engineering, or similar, is required
- Hands-on experience in optical lab work including setting up optical test benches, working in cleanrooms, eye safety considerations, etc. is required
- 6+ years of photonics package design, photonics packaging process development, or photonic sub-system/system manufacturing process design in the datacom / telecom industry is required
- Experienced in photonic packaging, transceiver manufacturing process, or wireline system (e.g. switch box/networking/rack) build methods and processes and process control mechanisms.
- Familiar with photonic package design and related systems and sub-systems.
- Knowledgeable of test for packaged ASICs, photonics, and systems
- Highly detail oriented, highly organized & methodical thinker.
- Able to tackle engineering challenges and devise structured R&D programs for process development.
- Independent, action-oriented, entrepreneurial, and with high sense of product ownership.
- Able to travel up to 70% both domestically and Internationally
Benefits:
- medical, dental, and vision insurance plans
- 401(k) retirement plan and employee stock purchase plan
- paid time off
- short-term incentive based on performance
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