Cooling Applications Engineer

Posted 8hrs ago

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Job Description

Cooling Application Engineer supporting Pre-Sales activities for cooling solutions in the U.S. hyperscale data center market. Providing technical expertise to sales teams and customers in cloud computing environments.

Responsibilities:

  • Collaborate with sales teams to present and position Direct Liquid Cooling (DLC), Rear-Door Heat Exchangers (RDHx), and advanced air-cooling solutions for hyperscale customers.
  • Analyze customer requirements and develop customized cooling architectures aligned with ASHRAE, Open Compute Project (OCP), and U.S. regulatory standards.
  • Conduct technical workshops, site visits, and proof-of-concept demonstrations for cloud providers, colocation operators, and enterprise clients.
  • Provide technical documentation, bid responses, and RFP/RFQ support to ensure compliance with customer specifications.
  • Work with R&D and product teams to tailor global solutions for U.S. hyperscale market needs.
  • Track emerging trends in high-density cooling, sustainability initiatives, and energy efficiency standards to guide product positioning.

Requirements:

  • Bachelor’s degree in Mechanical Engineering, Thermal Engineering, or a related field.
  • 3+ years of experience in application engineering, pre-sales, or technical sales support for data center cooling.
  • Strong expertise in heat transfer, fluid dynamics, and energy efficiency metrics (PUE, WUE, etc.).
  • Experience working with hyperscale data centers, cloud providers, or colocation facilities.
  • Knowledge of ASHRAE thermal guidelines, OCP cooling specifications, and North American compliance standards.
  • Excellent presentation and communication skills for engaging technical and executive audiences.
  • Ability to travel to customer sites, industry events, and corporate meetings (~30-40% travel).
  • Fluent in English; additional language skills are a plus.

Benefits:

  • Engage with top hyperscalers, cloud providers, and enterprise data centers in the U.S.
  • Be part of next-generation cooling innovations shaping the future of high-performance computing.