Field Application Engineer
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Job Description
Field Application Engineer with expertise in packaging substrates for a prominent electronic circuit solution provider. Responsible for market development and customer engagement in the U.S.
Responsibilities:
- Research and identify customer development opportunities across the United States
- Serve as the technical point of contact for customers, supporting product demand analysis and technical communication
- Analyze industry trends, product evolution, and customer feedback to guide development strategies
- Collect and interpret competitor intelligence to benchmark and position our offerings effectively
- Support the planning and participation in relevant trade shows and product exhibitions in the U.S.
- Build and expand customer acquisition channels to boost U.S. market penetration
Requirements:
- 5+ years of experience in the packaging substrate industry — with background in process engineering, product development, or technical support
- Hands-on knowledge of customer engagement and technical requirement management in advanced PCB or packaging substrate companies
- Must be based in the United States with permanent residency or equivalent legal work status
- Proactive, self-driven, and confident in handling external communication with U.S. clients
- Strong interpersonal skills with the ability to interface effectively with R&D and sales teams in China
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